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KLA-Tencor FleXus FLX-2908 Thin Film Stress Measurement Test System 5"/6"/8"

$ 21119.99

Availability: 80 in stock
  • Brand: KLA-Tencor
  • MPN: FLX-2908
  • Model: FLX-2908
  • Equipment Type: Thin Film Stress Measurement
  • Condition: We were told this unit is in working condition but we do not have the facility requirements to test it. It is guaranteed to power up but that is the extent of our ability to test it.

    Description

    KLA-Tencor FleXus FLX-2908 Thin Film Stress Measurement Test System 5"/6"/8"
    Comes with a manual and what you see in the pictures. If you don't see it, you probably won't get it.
    Specifications are from a 3rd party and may vary slightly due to upgrades, options, or revisions this unit may or may not have.
    We were told this unit is in working condition but we do not have the facility requirements to test it. It is guaranteed to power up but that is the extent of our ability to test it.
    The Main Unit's Serial Number Tag Reads:
    Model Number:
    FLX 2908
    Serial Number:
    0396-4501
    Power Requirements:
    208 VAC, 32 A, Single Phase, 60 Hz
    Date Manufactured:
    March 19th, 1996
    Software Version:
    WINFLX Version 4.40
    Accessories:
    Computer (486DX-66), Monitor, Keyboard (with trackball)
    Cables
    Holders for 8", 6" Round, 6" Flat, 5" Round, 5" Flat
    Description:
    The Tencor FLX-2900 is a thin-film stress measurement instrument. It accurately measures the changes in the radius of curvature of the substrate caused by the deposition of a stressed thin film. Some of the features include:
    Accurate stress measurement on all types of films including metals, oxides, and polyimides.  You can also measure stress as a function of time or temperature (maximum temperature 900°C). The software displays time-dependent and stress-temperature measurements automatically in graph form.
    An optical design that positions the laser scanning system below the furnace thus reducing noise during heating and cooling. This feature permits you to observe subtle changes in film sterss.
    Inert atmosphere capability allows the measurements to be made in a controlled atmosphere of nitrogen or argon.
    Ability to customize parameters such as number of scan points, elastic modulus, substrate thickness, and wafer diameter in the process programs. You can also specify heating and coolign cycles for sterss-temperature measurement.
    Ability to edit data records, plot graphs, and trend charts, and recalculate the stress for a saved ata file by changing the elastic modulus, wafer, or film thickness.
    Comprehensive data analysis capabilities that include calculating the biaxial modulus of elasticity and thermal expansion coefficient, displaying thermal stress superimposed on stress-temperature measurement data, file subtraction, and stress uniformity.
    Menus, screens, and windows are simple and easy to use. Key operation for each field is usually displayed at the bottom of the screen.
    Performance Specifications:
    Substrate Diameter:
    100-mm (4-in.), 125-mm (5-in.), 150-mm (6-in.), and 200 mm (8-in.) wafers. Note the 200-mm (8-in.) wafer is an option.
    Measurement:
    Speed:
    5 sec. for 150-mm wafer
    Range:
    2 x 10
    7
    to 2 x 10
    10
    dyne/cm
    2
    Minimum Radius:
    3.8 m
    Minimum Scan Step:
    0.02 mm
    RMS Noise:
    < 0.0001 m
    -1
    (radius = 10,000 m) at room temperature
    Maximum Points Per Scan:
    1250
    Temperature Range:
    Room temperature to 900°C
    Repeatability:
    The main source of repeatability error is the replacement accuracy of wafers. The typical Tencor Instruments 1 &sgima; error in 1/R is 1 x 10
    -7
    dynes/cm
    2
    for a 1-µm film on a 525 µm silicon substrate. Thicker films and thinner substrates will result in smaller errors and thinner films and thicker substrates will result in larger errors.
    Operating Speifications:
    Light Source:
    Two lasers: 4-mW solid state (GaA1As) laser with wave-length 670 nm and 4-mW solid state (GaA1As) laser with wavelength 750 nm
    Physical Specificationss:
    FLX-2900 Instrument:
    53.3 cm x 60.9 cm x 45.7 cm (21-in. x 24-in. x 18-in.) plus computer
    Weight:
    Approx. 58.96 Kg (130 lb)
    Opearting Environment Specifications:
    Operating Temperature:
    18-22°C (64-72°F)
    Air Quality:
    Class 100 or cleaner
    Gas:
    Inert gas (argon or nitrogen) flow rate: 2-5 CFH; 0.25-in pipe with a Swagelock connector
    Water Temperature:
    Water temperature 20°C (68°F); flow rate 2-3 liters/min; pressure 2-5 psi, 0.25-in pipe with a Swagelok connector
    System Power:
    Instrument: Standard: 20 amp., 230 V, 50/60 Hz. 200-mm option: 30 amp. at 230 V, 50/60 Hz. Computer 5.4 amp., 115 V, 50/60 Hz
    Computer and Peripheral Specifications:
    Computer:
    AST 33 MHz, 386 DX (This unit looks to have been upgraded to a 66 MHz 486 DX2 computer)
    Hard Disk:
    40 MB (It looks like the current HD may be 80 MB)
    Floppy Diskette Drive:
    3.5-in. high density (1.44 MB)
    Printer:
    Hewlett-Packard Deskjet Plus recommended; parallel interface
    Comm. Port:
    One male RS232 port connector for use as SECS-II port. Note: A gender changer changer is provided for use with the standard SECS cable. (I am not sure if there is a gender changer. There does appear to be a cable that goes from DB-9 female to DB-25 male)
    0.00 minimum for packaging, handling, and order processing. Shipping to be determined by destination.
    Prior to shipment I will need to know the following information (filled out on a form that I will send you) for International Customers or Packages/Freight being Forwarded internationally. International customers may also be subject to a freight forwarder form if applicable.:
    (1) Are you the end-user of this item?
    (2) If you are not the ultimate end-user of the item, please state the ultimate end user's name.
    (3) What is the ultimate country destination?
    12/24/21